In the case of using the Fan Out technology, antenna switch module (ASM) will be mini by the same chip technology integrated semiconductor GaAs (Gallium Arsenide). This compound helps receive high frequency without interference as well as improve reception. When "fan-out" technology is used, the antenna signal quality will not change, it also help save space.
New technology being integrated Apple next generation iPhone
" Apple has reduced the thickness on the product and increase battery life by combining the individual components ". A representative of the industry said.
Recently , TSMC chip supplier have been said to produce a product of “Fan –Out” technology for a single client. This client may be Apple with A10 chip for iPhone 7 .
At this time the Apple has not had any comment on these rumors .
According to the Korean Etnews, Apple is applying a new technology called RF (Radio Frequency) in the process of packing chips for the iPhone 7 which will be released in this autumn. The new technology will help the iPhone 7 becomes thinner and lighter, while still having high-capacity battery.
iPhone 7 will be lighter and thinner than 6s
The report also said that Apple applies the technology "Fan Out". This technology allows Apple to improve ASM signal transfer module (Antenna Switching Module) on the latest iPhone model. That means instead of having to increase the size of the chip, “Fan-Out” technology will improve cellular signal strength. Apple has co-operated a Japanese component supplier to apply this technology on the iPhone 7
iPhone 7 will have the thinness of 6mm when using Fan out packaging technology. The first launched technology essentially makes certain chips more powerful and efficient while making them smaller, which will allow Apple to reorganize the components in the iPhone 7 more efficiently.
